Ultra low power sensing platform with multimodal radios

ABSTRACT

An apparatus comprises a system on a chip (SoC). In some embodiments, the SoC includes a power supply circuit, a power management circuit operatively coupled to the power supply circuit, a first wireless communications circuit and a second wireless communications circuit. The first wireless communications circuit is configured to receive an RF signal and is operatively coupled to the power supply circuit and the power management circuit. The first wireless communications circuit has a net radio frequency (RF) power gain no more than unity before at least one of downconversion of the RF signal or detection of the RF signal. The second wireless communications circuit is operatively coupled to the power supply circuit and the power management circuit.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This patent application claims priority to U.S. Patent Application61/694,855 entitled “Ultra Low Power Wireless Sensing Platform withMultimodal Radios and Wakeup Radio” and filed on Aug. 30, 2012, and toU.S. Patent Application 61/780,008 entitled “Ultra Low Power WirelessSensing Platform with Multimodal Radios” and filed on Mar. 13, 2013;each of which is incorporated herein by reference in its entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with government support under CNS1035303 awardedby the National Science Foundation. The government has certain rights inthe invention.

BACKGROUND

Embedded systems can be used in a variety of applications, includingproviding monitoring, sensing, control, or security functions. Suchembedded systems are generally tailored to specific applications,according to relatively severe constraints on size, power consumption,or environmental survivability.

In particular, one class of embedded system can include sensor nodes,such as for sensing or monitoring one or more physiologic parameters, orfor other applications. A sensor node having wireless communicationcapability can be referred to as a Wireless Sensor Node (WSN).Similarly, a sensor node located on, nearby, or within a body of asubject can be referred to as a Body Area Sensor node (BASN) or BodySensor node (BSN). Sensor nodes can provide significant benefit to careproviders, such as enabling continuous monitoring, actuation, andlogging of physiologic information, facilitating automated or remotefollow-up, or providing one or more alerts in the presence ofdeteriorating physiologic status. The physiologic information obtainedusing the sensor node can be transferred to other systems, such as usedto help diagnose, prevent, and respond to various illnesses such asdiabetes, asthma, cardiac conditions, or other illnesses or conditions.

OVERVIEW

In a physiologic sensing example, a sensor node can provide particularvalue to a subject or care giver if the sensor node includes certainfeatures such as long-term monitoring capability or wearability, forexample. A long lifetime for a sensor node without maintenance,replacement, or manual recharging becomes ever more important as healthcare costs escalate or as more care providers attempt to transition toremote patient follow-up and telemedicine.

It is believed that generally-available sensor nodes are precluded fromwidespread adoption because of a lack of extended operational capabilityor wearability. For example, sensor nodes including a large primary orrechargeable battery can be uncomfortable to wear, and a sensor nodehaving a smaller battery is still undesirable because patients or otherusers may not comply with the required recharging or replacementinterval. Similarly, sensor nodes requiring conductive data transferinterfaces are generally cumbersome, because the wearer or care givertypically must manually connect a communication interface cable to thenode to transfer information to or from the node. Wireless communicationcircuitry may reduce or eliminate the need for such cumbersome wiredinterfaces. But, such wireless circuitry can consume substantial amountsof energy further taxing a limited energy budget or limiting operatinglife of generally-available sensor nodes.

In an example, a sensor node, such as a physiologic sensor node, caninclude one or more semiconductor devices having a high degree ofintegration of various system functions. Such a semiconductor device canbe referred to as a “System-on-a-Chip” or SoC. An SoC can providedigital or mixed signal circuitry realizing all major functions of thesystem, such as including one or more of general-purpose processorcircuits, special purpose processor circuits, analog signal conditioningcircuits, supply regulation or converter circuits, voltage or currentreference circuits, or power management circuits.

The sensor node can also include communication circuitry, such aswirelessly coupling the sensor node to one or more other devices such asto send or receive information. An array of one or more sensor nodes canbe coupleable to each other or to one or more other devices orassemblies. Such an arrangement can be referred to as a Body AreaNetwork (BAN).

The present inventors have recognized, among other things, thatultra-low power (ULP) techniques can be applied to one or more circuitsincluded in a sensor node. ULP techniques can be used such as to providean SoC included as a portion of a sensor node. For example, such an SoCfor a sensor node can include one or more analog or digital portionsconfigured for subthreshold operation.

Other techniques can be used instead of subthreshold operation, or inaddition to subthreshold operation, such as power or clock gating todisable or suspend operation of specified sections of the system, orincluding adjusting a duty cycle, a clock frequency (e.g., clockthrottling), or a supply parameter (e.g., supply voltage throttling) soas to reduce power consumption.

In an example, the sensor node need not include a battery. Instead of abattery, or in addition to a battery, the sensor node can include one ormore other power sources. For example, the sensor node can include anenergy-harvesting capability, such as using a thermoelectric generator(TEG). Such energy harvesting can include storing energy within aportion of an integrated circuit or “off-chip,” such as using acapacitor. A power supply circuit can be included as a portion of thesensor node, such as to provide conversion of energy provided by a powersource to one or more specified voltages.

In an example, a sensor node can include a source of operating energy, apower management processor circuit coupled to the source of operatingenergy and configured to select an energy consumption level of thesensor node based on a state of the source of operating energy, adigital processor circuit including an operational mode established bythe power management processor circuit based on the selected energyconsumption level, a memory circuit coupled to the digital processorcircuit, and a first wireless receiver circuit coupled to the memorycircuit. In an operational mode established by the power managementcircuit, the first wireless receiver circuit can be configured toreceive information wirelessly without requiring use of the digitalprocessor circuit and transfer at least a portion of the receivedinformation to the memory circuit without requiring use of the digitalprocessor circuit.

One or more of a protocol, data rate, operating frequency range, ormodulation technique used by one or more communication circuits of asensor node can be adjusted or selected, such as based on a selectedenergy consumption level established by the power management circuit.For example, the first wireless receiver circuit can be configured toconsume about 100 nanowatts (nW) or less, such as to provide capabilityof receiving information in most or all operational modes of the sensornode (e.g., an “always-on” receiver).

In contrast to duty-cycled approaches, operation of the first wirelessreceiver circuit continuously, or nearly continuously, can provideextremely low latency for sensor node response to commands or otherinformation received by the first wireless receiver circuit, despite atotal sensor node energy consumption of less than about , for example, 1microwatt (μW) in a standby mode. In an illustrative example, a latencycan be less than 10 milliseconds (ms) between receiving a specifiedpacket of information and a reaction by the sensor node to the packet,such as using a receiver circuit consuming less than about 100 nW, and atotal sensor node consumption less than about 1 μW, such as withoutrequiring a time consuming or energy depleting synchronization.

This overview is intended to provide an overview of subject matter ofthe present patent application. It is not intended to provide anexclusive or exhaustive explanation of the invention. The detaileddescription is included to provide further information about the presentpatent application.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates generally an example of a sensor node or a portionof a sensor node such as can be included in an integrated circuit.

FIG. 1B illustrates generally an example of a sensor node or a portionof a sensor node such as can be included in an integrated circuit.

FIGS. 2A through 2D illustrates generally an example of an architecturefor a sensor node or a portion of a sensor node such as can be includedin an integrated circuit.

FIG. 3 illustrates generally an addressing scheme that can be includedas a portion of a sensor node.

FIG. 4 illustrates generally a clocking scheme that can be included as aportion of a sensor node.

FIG. 5 illustrates generally a clock signal conditioning circuit thatcan be included as a portion of a sensor node, the clock signalconditioning circuit configurable to provide a specified clock signal.

FIG. 6 illustrates generally an example of a portion of a sensor nodethat can include three communication circuits coupled to a basebandcontroller circuit (e.g., a finite state machine).

FIGS. 7A through 7C illustrate generally an illustrative example of anarchitecture of a portion of a sensor node that can include threecommunication circuits coupled to a baseband controller circuit (e.g., afinite state machine).

FIG. 8 illustrates generally an example of a transmit bufferarchitecture that can be included as a portion of a sensor node.

FIG. 9 illustrates generally an example of a receive buffer architecturethat can be included as a portion of a sensor node.

FIG. 10 illustrates generally a technique, such as a method, that caninclude establishing an operational mode of one or more portions of asensor node, such as based on a state of a power source.

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

DETAILED DESCRIPTION

FIG. 1A illustrates generally a block diagram of an example 100A of asensor node or a portion of a sensor node such as can be included in anintegrated circuit. The sensor node can include or can be coupled to apower source 102. The power source 102 can include one or more of arechargeable battery, a primary cell battery, or an energy-harvestingcircuit.

For example, energy harvesting techniques can include obtaining energyfrom an ambient optical source, from electromagnetic coupling, from athermal gradient, or from a mechanical vibration. Energy harvestingtechniques can provide an extended operable lifetime as compared tosensor nodes reliant upon a battery. To provide sustained operation,however, an energy-harvesting sensor node generally consumes less energythan the amount harvested over the relevant period of time. The sensornode can be battery-less or can operate without requiring a primary orrechargeable battery, such as powered continuously or for an extendedperiod of operating using one or more of wirelessly-coupled energy orenergy provided using energy harvesting techniques.

The sensor node can include one or more of a digital processor circuit112, such as a microcontroller or microprocessor circuit, or a functionspecific processor circuit 114 (e.g., an “accelerator circuit”). Thesensor node can include one or more wireless communication circuits,such as a first wireless receiver circuit 124. The digital processorcircuit 112 and the first wireless receiver circuit can be coupled to amemory circuit 116, such as using a bus 138.

One or more digital portions of the examples shown in FIGS. 1A and 1B,or elsewhere, can operate in a subthreshold operational mode. Asubthreshold operational mode can be established such as providing,adjusting, or selecting a supply voltage provided by a regulator circuit(not shown in FIGS. 1A and 1B) so as to establish subthreshold operationof a field effect transistor (FET) in one or more of the powermanagement processor circuit 106, the digital processor circuit 112, thefunction-specific processor circuit 114, or in one or more othercircuits of the system, such as in one or more digital or mixed signalcircuits.

Subthreshold operation can be described as operating one or more FETs ina weak-inversion mode where a gate-to-source voltage is established ator below a threshold voltage (V_(t)) for the one or more FETs, resultingin a primarily exponential dependence on drain-to-source current as afunction of gate-to-source voltage. Various techniques can be used toestablish subthreshold operation, such as providing a supply voltagehaving a VDD-to-VSS voltage below the threshold voltage of all FETs in asection coupled to the supply voltage. However, subthreshold operationmodes of the digital or analog portions of the sensor node need not beestablished by using supply voltages below the threshold voltage of allFETs in a particular section. For example, a respective subset of one ormore FETs can be biased to establish subthreshold operation, while suchblocks may be still be connected to respective supply voltages in excessof the threshold. Alternatively, or additionally, an operational mode ofa section or block can be established such as selecting a power supplybus from amongst an available group of power supply busses configured toprovide respective operating voltages, or by adjusting a power supplybus voltage using an adjustable power supply circuit.

A tradeoff can exist between energy efficiency, maximum clock speed, andsupply voltage. Subthreshold operation need not be restricted to asingle supply voltage. For example, one or more of a clock frequency ora supply voltage can be adjusted such as to provide a specified level ofcomputational capability or other operational performance whilemaintaining low power consumption, as discussed in the examples below.

Other criteria can be used to specify or describe subthresholdoperation, such as using a current density perspective. For example,subthreshold operation can be described as a region of FET operationwhere transconductance (e.g., g_(m)) is at a relative or absolutemaximum, or where transconductance is primarily dependent on thresholdvoltage and drain current, and exhibits only a weak (or no) dependenceon variation in gate-to-source voltage. Such subthreshold operation,along with or instead of other techniques, can provide the sensor nodewith extended longevity even though the available energy obtained usingthe wireless receiver circuit or energy harvesting transducer may bequite limited (e.g., on the order of microwatts).

The sensor node can include a power management processor circuit 106that can be configured to adjust an energy consumption level of thesensor node, such as using information obtained by monitoring a state ofthe power source 102. For example, if the power source 102 includes abattery or capacitor, the monitored state of the power source caninclude one or more of a voltage or a charge state of the battery orcapacitor. Other criteria can be used to provide information indicativeof the state of the power source 102, such as an output voltage orcurrent provided by an energy harvesting circuit.

The power management processor circuit 106 can establish operationalmodes of one or more other portions of the sensor node, such asselecting or controlling an operational mode of the digital processorcircuit 112, the function specific processor circuit 114, the firstwireless receiver circuit 124, or the memory circuit 116, such as usinginformation about the state of the power source 102. For example, thedigital processor circuit can be one or more of suspended or disabled inan energy consumption mode selected by the power management processorcircuit 106, such as based on a selected energy consumption level of thesensor node. Such an energy consumption level can be selected fromamongst a group of available energy consumption levels or schemes, suchas based on or using information about an available amount of energy ora state of a power source 102. Such schemes can include a look-up tableor other information indicative of respective modes for respectivefunctional blocks of the sensor node corresponding to respectiveselected energy consumption levels. Such levels or schemes may bereconfigured, such as on-the-fly using information received using thefirst wireless receiver circuit 124.

In an example, with the sensor node in an energy consumption levelcorresponding to a standby, sleep, or low energy consumption state, thefirst wireless receiver circuit 124 can be configured to receiveinformation wirelessly without requiring use of the digital processorcircuit 112 or the function-specific processor circuit 114. For example,the sensor node can be configured to provide wireless receiving ofinformation (e.g., radiatively coupled to the first wireless receivercircuit 124), and transfer of wirelessly-received information to aportion of the memory circuit 116 (e.g., using a direct memory access(DMA) scheme), while other portions of the sensor node or suspended ordisabled. The memory circuit 116 can include a volatile memory circuit,such as a static random access memory (SRAM) or other memory technology,such as configured for a subthreshold operational mode.

FIG. 1B illustrates generally a block diagram of an example 100B of asensor node or a portion of a sensor node such as an integrated circuit.The example 100B of FIG. lB can include a power source 102 (e.g., one ormore of a battery, a thermoelectric energy source, a mechanical energysource, or one or more other sources, as discussed above). The powersource 102 can be located “off-chip” with respect to one or more othercircuits included as a portion of the sensor node.

The power source 102 can be coupled to a power supply circuit 104. Ifthe voltage provided by the power source 102 is below a desired powersupply circuit 104 output voltage range, the power supply circuit 104can include a “boost” configuration (e.g., a DC-to-DC converter), suchas to provide one or more specified direct current (DC) voltages toother circuitry, such as using a power supply bus 108. The power supply104 can be coupled to other circuitry, such as a power managementcircuit 106, a general purpose processor circuit 112 (e.g., amicrocontroller unit (MCU) or microprocessor core), a function-specificprocessor circuit 114, a memory circuit 116, an analog input 118, abaseband controller circuit 122, a first wireless receiver circuit 124,a second wireless receiver circuit 126, or a first transmitter circuit128.

The power management circuit 106 can be included as a portion of adigital section 160 of a System-on-Chip (SoC). Such a digital section160 can include one or more other digital circuits, such as the generalpurpose processor circuit 112, the function-specific processor circuit114 (or multiple accelerator circuits), or the memory circuit 116. Oneor more of the circuits included in the digital section 160, or othercircuits, can be configured to provide a subthreshold operational modeor a superthreshold operational mode. In the subthreshold operationalmode, such digital circuitry can consume significantly less power at thecost of higher leakage and slower switching time, as compared to asuperthreshold operational mode.

In an example, the general purpose processor circuit 112 can be placedin a standby operational mode (e.g., in a low-power-consuming mode thatcan include an entirely powered-down state, or a clock-gated state). Thepower management circuit 106 can be configured perform control orsupervisory functions while the general purpose processor circuit 112 isin the standby mode or otherwise disabled.

The power management circuit 106 or the general purpose processorcircuit 112 can be coupled to a first communication bus 110A or a secondcommunication bus 110B. The busses 110A through 110B need not bephysically separate. The power management circuit 106 or the generalpurpose processor circuit 112 can control other circuits either usingthe respective buses 110A through 110B, or through memory-mappedconfiguration registers, such as store using the memory circuit 116.

For example, one or more of the first wireless receiver circuit 124, thesecond wireless receiver circuit 126, or the first transmitter circuit128 can be configured to access the memory circuit 116, such as using acoupling 120. The memory circuit 116 need not be a single circuit orarray, and can include various buffers such as a first-in-first-out(FIFO) buffer.

The first wireless receiver circuit 124 can be configured to receiveinformation indicative of a command for the sensor node (e.g., a commandto activate or enable other portions of the sensor node), configurationinformation for other portions of the sensor node, or instructions to beperformed by the general purpose processor circuit 112, for example. Asdiscussed in the example of FIG. 1A, the first wireless receiver circuitcan include an ultra-low-power (ULP) architecture, such as to providecontinuous or nearly-continuous receiving capability in all operationalmodes that can be established by the power management circuit 106. In anillustrative example, a latency can be less than 10 milliseconds (ms)between receiving a specified packet of information and a reaction bythe sensor node to the packet, such as using a first wireless receivercircuit 124 consuming less than about 100 nW, and a total sensor nodeconsumption less than about 1 μW, such as without requiring a timeconsuming or energy depleting synchronization.

One or more of the first wireless receiver circuit 124, the secondwireless receiver circuit 126, or the first transmitter circuit 128 canbe configurable such as based on a selected energy consumption levelestablished by the power management circuit 106, or other circuits. Forexample, one or more of which radio to use, a protocol, a data rate, amodulation scheme, or a frequency range for communication can beselected based on the selected energy consumption level. In this manner,respective communication circuits can be used or enabled to establish aspecified energy consumed per communicated bit based on an availableamount of energy. As discussed above, such an energy consumption levelcan be specified at least in part using information about a state of apower source 102.

In an example, the second wireless receiver circuit 126 can receiveinformation at a higher data transfer rate than the first wirelessreceiver circuit 124. The second wireless receiver circuit 126 can beone or more of duty-cycled or disabled when a specified energyconsumption level is selected, such as when a state of the power source102 indicates a relative dearth of available energy. The first wirelessreceiver circuit 124 can remain enabled in such a selected energyconsumption level. If the state of the power source 102 indicates anabundant supply of available energy, the second wireless receivercircuit 126 can be re-enabled or duty cycling of the second wirelessreceiver circuit 126 can be inhibited.

In an example, the first wireless receiver circuit 124 can receive acommand to change an energy consumption level of the sensor node withoutrequiring the intervention of one or more of the power managementcircuit 106 or the general purpose processor circuit 112.

FIGS. 2A through 2D illustrate generally an illustrative example (e.g.,depicted using the portions 200A through 200D) of an architecture of atleast a portion of a sensor node, such as can include an integratedcircuit. The portions 200A through 200D illustrate generally a system,such as a portion of an SoC, that can provide sensing capabilities. Suchsensing capability can be used for obtaining physiologic information,such as for real-time transmission or for storage. In illustrativeexamples, such information can include one or more of anelectrocardiogram (ECG); an electroencephalogram (EEG); anelectromyogram (EMG); or other physiologic information such asinformation indicative of health or wellness including gait data or bodytemperature, for example. The sensor node can provide one or more ofdata acquisition, signal analysis, processing, or wirelesscommunication, and can include a battery-less configuration or anenergy-harvesting circuit 202.

The illustrative example of FIGS. 2A through 2D can include or can becoupled to one or more communication circuits, such as shown in theexamples of FIG. 6 or 7A through 7C, or to other circuits or modulessuch as discussed in other examples. For example, in FIG. 2A, the sensornode can include a clock circuit 230 (e.g., a clock generation circuit)configured to generate one or more clock signals for use by othercircuits. Such clock signals can be further modified such as using aclock signal conditioning circuit 242 (e.g., a clock arbiter), such asshown in the illustrative example of FIG. 5. The sensor node can includea power supply circuit (e.g., a regulator circuit) 202, such asconfigured to run exclusively on harvested energy or using one or moreother power sources (e.g., a capacitor, or a rechargeable or primarybattery).

The sensor node can include a digital section configured for asubthreshold operational mode, such as configured to perform processingthrough one or more function-specific processor circuits 216 (e.g., asshown in FIG. 2C), or a general purpose processor circuit 212 (e.g., asshown in FIG. 2A). The digital section can include a power managementcircuit 206, the general purpose processor circuit 212 (e.g., a low“weight” microcontroller), and a memory circuit. For example, the memorycircuit may include an instruction memory 218B, a data memory 218A, andone or more FIFOs such as a high-speed FIFO 218C (e.g., as shown in FIG.2B).

For another example, the sensor node can include a digital sectionhaving one or more portions configured for a substhreshold operationalmode and one or more portions configured for a superthresholdoperational mode. Such an arrangement of an SoC can be used, forexample, in connection with interfacing with components, devices, orperipherals that are on a different chip (“off-chip”). The SoC canperform certain functions within the chip using the digital sectionportion(s) operating in subthreshold and can perform certain functionssuch as off-chip access or interface using the digital sectionportion(s) operating in superthreshold. Alternatively, a common digitalsection can be configured to operate in subthreshold while in oneoperational mode and to operate in superthreshold while in anotheroperational mode. For example, such a common digital section can operatein the subthreshold operational mode while performing local functionsand can switch to operating in the superthreshold operational mode whileaccessing or interfacing with peripherals off chip.

As shown in FIG. 2B, the sensor node can include an analog “front-end”(e.g., an analog input circuit 216), such as can include a low noiseamplifier (LNA) or a variable gain amplifier (VGA)). The analog“front-end” can include one or more of a programmable gain or one ormore analog-to-digital converters (e.g., a 12-bit and an 8-bitanalog-to-digital converter).

In the illustrative example of FIGS. 2A through 2D, the sensor node canobtain information indicative of physiologic signals or otherinformation such as using the four-channel analog input 216. Signalsprovided to the four-channel analog input 216 can be digitized using oneor more of an 8 bit (e.g., a successive approximation converter) or a 12bit (e.g., sigma-delta) converter, or one or more other topologies,depending on the sampling frequency, precision, or accuracy desired, orbased on a selected energy consumption level.

The sensor node can include one or more conductively-coupledcommunication circuits, such as conforming to one or more standards(e.g., an I2C communication interface, or an SPI configurationinterface). For example, information indicative of physiologic activitycan be obtained such as using one or more off-the-shelf sensors such asan accelerometer, and can be transferred to other circuitry in thesensor node using one or more interfaces provided by a serial section244.

In the illustrative example of FIGS. 2A through 2D, data can betransferred between various circuits such as using one or more 16-bitbuses, or using other topologies. For example, such data buses can beused for transfer of information between the analog input 216 or serialsection 244 and other circuitry. In an illustrative example, a first buscan be controlled by one or more of the power management circuit 206(e.g., a digital power manager (DPM)) or the general purpose processorcircuit 212 (e.g., an openMSP430 microcontroller circuit, or one or moreother processor circuits). For example, the first bus can use two clockcycles to move data between peripheral memory locations. In anillustrative example, a second bus can be controlled by a Direct MemoryAccess (DMA) controller circuit 246 (e.g., a two-channel DMA controllercircuit), such as provide single-cycle moves to reduce energyconsumption. Both buses can use an 8-bit addressing scheme. The DMAcontroller circuit 246 can be used to facilitate information transferbetween one or more wireless communication circuits and a memory circuitwithout requiring use of other more energy-consuming circuits such asthe general purpose processor circuit 212.

In an illustrative example, an ultra low power (ULP) wireless receivercircuit can be configured to wirelessly receive information and totransfer at least a portion of the received information to one or moreof the data memory 218A or the instruction memory 218B, or to one ormore other locations (e.g., a configuration register), such as usingDMA, without requiring use of the general purpose processor circuit 212.

The one or more function-specific processor circuits 216 can be easilyincorporated or removed from the architecture without disrupting thestructure of the other circuits in the architecture. For example, one ormore function-specific processor circuits 216 can be included or removeddepending on the nature of the information to be obtained by the sensornode.

The one or more function specific processor circuits 216 can beconfigured for operation in one or more of a subthreshold andsuperthreshold operational mode. For example, a subthreshold operationalvoltage can be determined at least in part using information aboutprocessing timing requirements (e.g., a minimum, a maximum, or aspecified duration over which a processing function may be completed),to provide enhanced energy efficiency, such as based on a selectedenergy consumption level.

A subthreshold operational voltage can be specified to provide a minimumor reduced energy consumption while meeting a required timingspecification, or noise margin. In an illustrative example, selection ofa superthreshold or subthreshold operating voltage can be established ina CMOS design such as using a power supply voltage that is selectablethrough one or more PMOS headers, such as power gated to reduce leakage,such as based on a selected energy consumption level.

The one or more function-specific processor circuits 216 can beconfigured to provide one or more of a Finite-Impulse-Response (FIR)filter circuit (e.g., having a selectable or controllable number oftaps), a Fast-Fourier-Transform (FFT) circuit, anInfinite-Impulse-Response (IIR) filter circuit, a discrete cosinetransform (DCT) circuit, a polynomial-fitting circuit, a comparatorcircuit, a parametric extraction circuit, an interval determinationcircuit, a coordinate rotation digital calculation (CORDIC) circuit, orone or more other circuits. Other examples of processor circuits caninclude an R-R interval extraction circuit, such as can be configured touse a Pan Tompkins algorithm, or an atrial fibrillation detectioncircuit.

In an illustrative example, the general purpose processor circuit 212can include an open-source microcontroller, such as an openMSP430architecture (e.g., synthesized from code available from “opencores.com”(Stockholm, Sweden)), such as configured to perform one or moreinstructions included in an MSP430 instruction set. Such a generalpurpose processor circuit 212 can be used to perform instructions oroperations not available through the one or more function-specificprocessor circuits 216. In an example, the general purpose processorcircuit 212 can be suspended or disabled, such as power supply gated orclock gated, based on the selected energy consumption level. During aninterval where the general purpose processor circuit 212 is power supplygated or clock gated, a wireless receiver circuit (e.g., the firstwireless receiver circuit of examples discussed elsewhere) can receiveinformation indicative of instructions to be performed by the generalpurpose processor circuit 212. The general purpose processor circuit 212can be re-enabled, such as to perform operations based on the receivedinstructions.

The power management circuit 206 can be “lighter weight” than thegeneral purpose processor circuit 212, such as including a simpler ormore power-efficient architecture configured for simple operations(e.g., supervisory operations) to reduce or eliminate a need for thegeneral purpose processor circuit 212 to be active and consuming power.The power management circuit 206 can be configured to manage powerconsumption of the sensor node, such as reducing the node's powerconsumption as the rate of energy harvesting decreases, or in responseto other events such as a received sleep command or other commands. Thepower management circuit can be programmable, and can be configured tochange a power consumption configuration to a desired state within asingle clock cycle, including predicting a need for a change in a powerconsumption state. Such a power consumption state can include, forexample, placing one or more circuits in a standby or reduced powerconsumption operational mode, establishing a subthreshold operationalmode, or establishing a superthreshold operational mode.

The sensor node can include other circuits, such as one or more timers(e.g., a 16-bit radio timer 248), a transmit buffer register 250, or oneor more finite state machines (FSMs), such as a read address FSM 252.Control of various circuits can occur using the first or second buses,or using memory-mapped configuration information, such as aconfiguration memory map 216D that can be used to control one or morewireless communication circuits. A memory map can be used forconfiguration or control of other circuitry, such as to configure orcontrol the one or more function-specific processor circuits 216.

FIG. 3 illustrates generally an addressing scheme 300 that can beincluded as a portion of a sensor node. As discussed in the illustrativeexample of FIGS. 2A through 2D, the sensor node can a first buscontrolled by one or more of the power management circuit 206 (e.g., adigital power manager (DPM)) or the general purpose processor circuit212 (e.g., an openMSP430 microcontroller circuit, or one or more otherprocessor circuits), and a second bus controlled by a Direct MemoryAccess (DMA) controller circuit 246. The one or more function-specificprocessor circuits (e.g., a first accelerator circuit 314A through an“Nth” accelerator circuit 314N) can include three respective decoderseach, such as configured to avoid write conflicts between the two buses.

FIG. 4 illustrates generally a clocking scheme 430 that can be includedas a portion of a sensor node. In the example of FIG. 4, a temperaturestabilized low-power frequency loop lock (FLL) 454 can be used, such asto provide a specified lock frequency corresponding to a mode of acrystal (e.g., locked to a 50 kilohertz (kHz) crystal oscillator).Depending on a configurable operating mode (e.g., based on a selectedenergy consumption level), a second feedback loop can be used, such asincluding a phase locked loop (PLL) 456, such as to provide a frequencyrange extended beyond a range available using the PLL 456 alone, such asup to 500 kHz in an illustrative example. One or more of the FLL 454 orthe PLL 456 can be bypassed, such as to provide a less stablecrystal-referenced output while consuming less power, such as based onselected energy consumption level.

FIG. 5 illustrates generally a clock signal conditioning circuit 542(e.g., a clock arbiter) that can be included as a portion of a sensornode, the clock signal conditioning circuit 542 configurable to providea specified clock signal. The clock signal conditioning circuit 542 canprovide one or more programmable clocks, such as for use by one or moreof an analog input (e.g., an analog-to-digital converter sample clock,or one or more function-specific accelerator blocks), such as using oneor more dividers (e.g., counters). In an illustrative example, the clocksignal conditioning circuit 542 can be included in a digital section ofthe sensor node, such as included within a footprint of thegeneral-purpose processor circuit layout included in an integratedcircuit.

FIG. 6 illustrates generally an illustrative example 600 of a portion ofa sensor node that can include, for example, three communicationcircuits coupled to a baseband controller circuit 622 (e.g., a finitestate machine (FSM)). The three communication circuits can include afirst receiver circuit 624 (e.g., an ultra low power receiver circuitthat can be continuously enabled or nearly continuously enabled), asecond receiver circuit 626 (e.g., narrow-band receiver), and a firsttransmitter circuit 628 (e.g., an ultra-wide band transmitter, such ascan be configured to support multiple Media Access Control (MAC)protocols).

One or more operational modes of the communications circuits, ortriggering of various operations can be controlled such as using thebaseband controller 622, without requiring a general purpose processorcircuit 612 (e.g., a microcontroller unit (MCU)) to be powered up or ina high-power consumption mode. For example, the general purposeprocessor circuit 612 can be in a subthreshold operational mode or alow-power consumption standby mode while the first receiver circuit 624awaits wireless receipt of one or more commands or instructions to beperformed by the general purpose processor circuit 612.

A memory map 616 can be used to configure one of the baseband controllercircuit 622 or one or more of the three communication circuits. Forexample, information to be transmitted by the first transmitter circuit628 can be buffered for transmission, independent of the general-purposeprocessor circuit 612, such as using a transmit buffer 660. Similarly,information received, such as using the second receiver circuit 626, canbe buffered using a receiver buffer 658 while awaiting transfer orprocessing by the general-purpose processor circuit 612.

FIGS. 7A through 7C illustrate generally an illustrative example of anarchitecture of portions 600A through 600C of a sensor node that caninclude three communication circuits coupled to a baseband controllercircuit, such as shown and discussed generally in the example of FIG. 6.A first wireless receiver circuit 624 can include a tuned receivercircuit and envelope detector (e.g., to receive one or more ofamplitude-shift-keyed or on-off-keyed wireless signals). The firstwireless receiver circuit 624 can be configured to remain operationalconstantly (e.g., an “always on” mode), or to power-up during specifieddurations to “sniff” for a specified command, such as one or morecommands. Power consumption performance of the first wireless receivercircuit 624 can be enhanced at least in part at a cost of reducedsensitivity. For example, the first wireless receiver circuit 624 caninclude a net gain of about unity or less before detection orrectification. In an illustrative example, the first wireless receivercircuit 624 can include an ultra-low-power (ULP) architecture, such asconsuming less than about 100 nW at a sensitivity of about −40 decibelsrelative to one milliwatt (dBm), using a first specified data transferrate.

The second wireless receiver circuit 626 can include a narrow-bandreceiver, such as configured to receive one or more of angle-modulatedor amplitude-modulated wireless communication signals. The secondwireless receiver circuit can include one or more phase-locked loops(PLLs), and can receive information a second specified data transferrate. Generally, a power consumption of the second receiver circuit 626can be higher than the first receiver circuit 624. The second receivercircuit 626 can remain in a low power consumption state, such as astandby mode, unless activated, such as in response to a commandreceived by the first receiver circuit 624, or based on a selectedenergy consumption level established by a power management circuit.

The first wireless transmitter circuit 628 can include a widebandtransmit circuit (e.g., an ultrawideband (UWB) transmitter), or otherarchitecture, such as configured to transmit information wirelesslyincluding energy at about 1 GHz or higher. For example, the firsttransmitter circuit 628 can be configured to transmit a burst ofwireless information. The first wireless transmitter circuit 628 can usea specified data transfer rate that is higher than either of the firstreceiver circuit 624, or the second receiver circuit 626. Such adifference in data transfer rates between respective communicationcircuits can be referred to as an “asymmetric” communicationconfiguration. Such an asymmetric configuration can be desirable for asensor node, because the sensor node will generally have large amountsof sensed physiologic information to upload to another device whilegenerally only receiving limited amounts of data such as operationalcommands, configuration information, or firmware updates.

As shown and discussed in the example of FIG. 6, the communicationscircuits can be coupled to a baseband controller 622 such as a finitestate machine (FSM). For example, a first type of command can bereceived using the first wireless receiver circuit 624, and in response,the baseband controller circuit 622 can trigger the first transmittercircuit 628 to transmit a burst of buffered information (e.g., storedusing a transmit buffer 660 or elsewhere). In another example, a secondtype of command can be received using the first wireless receivercircuit 624, and in response, the baseband controller 622 can “awaken”one or more other portions of the sensor node, such as transitioning ageneral purpose processor circuit 712 from a low power consumption state(e.g., a standby operational mode or a subthreshold operational mode)into a higher power consumption state.

In another example, the baseband controller circuit 622 can routeinformation received by the first or second receiver circuits 624, 626to a receive buffer 658, generate or receive one or more interrupts, orgenerally steer such information into one or more of instruction memory,data memory, configuration registers, or memory mapped registers,without requiring use of the general purpose processor circuit.Generally, the baseband controller 622 can also be configured to selectoperational modes of the communication circuits at least in usinginformation about a selected energy consumption state. In this manner,modes such as buffered or burst communication, protocol selection, datatransfer rate, modulation technique, or operating frequency range can beestablished using information about available energy, under the controlof one or more of a power management circuit or one or more processorcircuits.

FIG. 8 illustrates generally an example of a transmit buffer 660architecture that can be included as a portion of a sensor node, such ascan be used in relation to one or more examples discussed above orbelow.

FIG. 9 illustrates generally an example of a receive buffer 658architecture that can be included as a portion of a sensor node, such ascan be used in relation to one or more examples discussed above orbelow.

FIG. 10 illustrates generally a technique 1000, such as a method, thatcan include, at 1002, selecting an energy consumption level of a sensornode (e.g., as described and shown in the examples of FIGS. 1A-1B,2A-2D, 3-6, 7A-7C, or 8-9), such as based on a state of a source ofoperating energy. At 1004, an operational mode of a digital processorcircuit (or one or more other circuits) can be established based on theselected energy consumption level of the senor node. At 1006,information can be received wirelessly, such as without requiring use ofthe digital processor circuit. For example, the digital processorcircuit can be one or more of suspended or disabled, and at 1008,wirelessly-received information can be transferred to a memory circuitwithout requiring use of the processor circuit. Such wirelessly-receivedinformation can include instructions that can be performed by thedigital processor circuit.

As mentioned above, the SoCs discussed herein can predict energy-usagebehaviors or patterns and cause changes in the operation of the sensoror SoC. For example, an SoC can include a prediction circuit (not shown)operatively coupled to or included as a portion within the powermanagement circuit 206. The prediction circuit can receive signalsindicating the status of the associated energy sources such as anon-chip power source, an off-chip source or an energy harvesting circuit(either on the SoC or off chip). The prediction circuit can analyzethese status signals and the times associated with the statusinformation to identify profiles, behaviors or patterns of the energyreceived and/or stored and the energy used. For example, the predictioncircuit can identify correlations between harvested energy levels andtimes of day. For another example, the prediction circuit can identifycorrelations between harvest energy levels and sensor data such as acorrelation between the monitored heart rate and body temperature of aperson: when the monitored heart rate increases the body temperaturelikely increases, thereby making it more likely that the energyharvested from, for example, a thermo-electric based energy harvestingcircuit will increase. For another example, the prediction circuit canidentify periodicity within a certain tolerance.

Based on such predictions, the prediction circuit can send predictionsignals to the power management circuit (or other portions of powermanagement circuit). The prediction signals can indicate or presentprediction information and/or the related data such as predictionprofiles, prediction values, stored energy and time values, etc. Uponreceiving the prediction signals, the power management circuit canselect an operational mode for the SoC. For example, upon receiving theprediction signals, the power management circuit can select anoperational mode of the SoC that is appropriate for a given powerconsumption level based on the prediction signals and/or other factors.For example, power management circuit can select an operational modebased on an amount of energy incoming to the SoC, an amount of storedenergy associated with the SoC, or a rate of power consumption by theSoC.

Various Notes & Examples

Each of the non-limiting examples disclosed in this document can standon its own, or can be combined in various permutations or combinationswith one or more of the other examples.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code can be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media can include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMs), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

1. An apparatus, comprising: a system on a chip (SoC) including: a powersupply circuit; a power management circuit operatively coupled to thepower supply circuit; a first wireless communications circuit configuredto receive an RF signal and operatively coupled to the power supplycircuit and the power management circuit, the first wirelesscommunications circuit having a net radio frequency (RF) power gain suchthat an output signal power is no greater than an input signal power andthe first wireless communications circuit being configured to remainoperational constantly during operation of the SoC; and a secondwireless communications circuit operatively coupled to the power supplycircuit and the power management circuit.
 2. The apparatus of claim 1,wherein: the first wireless communications circuit is configured tooperate according to a first communication standard, the second wirelesscommunications circuit is configured to operate according to a secondcommunication standard different than the first communication standard.3. The apparatus of claim 1, wherein: the RF signal is a first RFsignal; the first wireless communications circuit is configured toreceive the first RF signal at a first frequency band, the secondwireless communications circuit is configured to perform at least one oftransmit a second RF signal or receive a third RF signal at a secondfrequency band different than the first frequency band.
 4. The apparatusof claim 1, wherein: the RF signal is a first RF signal; the firstwireless communications circuit is configured to receive the first RFsignal at a first frequency band, the second wireless communicationscircuit is configured to transmit a second RF signal at a secondfrequency band different than the first frequency band, the secondwireless communications circuit having an ultra-wideband (UWB)transmitter.
 5. The apparatus of claim 1, wherein: the SoC includes amemory circuit and a digital processor circuit, the first wirelesscommunications circuit is configured to receive the RF signal withoutrequiring use of the digital processor circuit, the RF signal havinginformation, the first wireless communications circuit is configured tosend the information to the memory circuit without requiring use of thedigital processor circuit.
 6. The apparatus of claim 1, furthercomprising: an analog sensor interface circuit operatively coupled tothe SoC, the analog sensor interface circuit and the SoC collectivelydefining a wireless sensor node configured to collect sensor data andsend wirelessly a signal based on the sensor data.
 7. The apparatus ofclaim 1, wherein: the power supply circuit includes an energy harvestingcircuit, the power management circuit, the first wireless communicationscircuit and the second wireless communication circuit configured to bepowered by the energy harvesting circuit.
 8. The apparatus of claim 1,wherein: the power management circuit is configured to select anoperational mode from a plurality of operational modes based on at leastone of (1) an amount of energy incoming to the SoC, (2) an amount ofstored energy associated with the SoC, or (3) a rate of powerconsumption by the SoC, the plurality of operational modes including afirst operational mode and a second operational mode, the powermanagement circuit configured to send a signal to the first wirelesscommunication circuit when the first operational mode is selected suchthat the first wireless communication circuit is activated, the powermanagement circuit configured to send a signal to the second wirelesscommunication circuit when the second operational mode is selected suchthat the second wireless communication circuit is activated.
 9. Theapparatus of claim 1, wherein: the SoC includes a first transistor and asecond transistor, the first wireless communication circuit isoperatively coupled to the first transistor, the first transistor isconfigured to gate power received by the first wireless communicationcircuit, the second wireless communication circuit is operativelycoupled to the second transistor, the second transistor is configured togate power received by the second wireless communication circuit.
 10. Anapparatus, comprising: a system on chip (SoC) having a first memorycircuit portion and a second memory circuit portion, the first memorycircuit portion configured to operate at a subthreshold voltage, thesecond memory circuit portion configured to operate at a superthresholdvoltage, the SoC configured to access the second memory circuit portionwhen at least one of (1) signals are sent from the SoC, or (2) signalsare received at the SoC.
 11. The apparatus of claim 10, wherein: thefirst memory circuit portion is configured to operate at thesubthreshold voltage and not at a superthreshold voltage; the secondmemory circuit portion is configured to operate at the superthresholdvoltage and not at a subthreshold voltage.
 12. The apparatus of claim10, wherein: the first memory circuit portion and the second memorycircuit portion collectively define a memory circuit having a firstoperational mode and a second operational mode, the memory circuitconfigured to operate the first memory circuit portion when the memorycircuit is in the first operational mode, the memory circuit configuredto operate the second memory circuit portion when the memory circuit isin the second operational mode.
 13. The apparatus of claim 10, wherein:the first memory circuit portion and the second memory circuit portioncollectively define a memory circuit having a first operational mode anda second operational mode, the memory circuit configured to operate thefirst memory circuit portion and not the second memory circuit portionwhen the memory circuit is in the first operational mode, the memorycircuit configured to operate the second memory circuit portion and notthe first memory circuit portion when the memory circuit is in thesecond operational mode.
 14. An apparatus, comprising: a SoC including aprediction circuit and a power management circuit; the predictioncircuit is configured to receive a plurality of status signals from anenergy harvesting circuit, each status signal from the plurality ofstatus signals indicating an amount of energy harvested by theharvesting circuit during a time period from a plurality of timeperiods; and the prediction circuit is configured to send to the powermanagement circuit a prediction signal based on the plurality of statussignals, the power management circuit configured to select anoperational mode of the SoC associated with a power consumption levelbased on the prediction signal.
 15. The apparatus of claim 14, wherein:the power management circuit is configured to select an operational modefrom a plurality of operational modes based on at least one of (1) anamount of energy incoming to the SoC, (2) an amount of stored energyassociated with the SoC, or (3) a rate ofpower consumption by the SoC,the plurality of operational modes including a first operational modeand a second operational mode, the power management circuit configuredto send a signal to a first wireless communication circuit when thefirst operational mode is selected such that the first wirelesscommunication circuit is activated, the power management circuitconfigured to send a signal to a second wireless communication circuitwhen the second operational mode is selected such that the secondwireless communication circuit is activated.
 16. The apparatus of claim14, wherein: the SoC including a first wireless communication circuitand a second wireless communication circuit, the power managementcircuit configured to select an operational mode from a plurality ofoperational modes including a first operational mode and a secondoperational mode, the power management circuit configured to send afirst signal to the first wireless communication circuit when the firstoperational mode is selected, the first wireless communication circuitbeing activated in response to the first signal, the power managementcircuit configured to send a second signal to a second wirelesscommunication circuit when the second operational mode is selected, thesecond wireless communication circuit being activated in response to thesecond signal.
 17. An apparatus, comprising: a system on chip (SoC)having a first circuit portion and a second circuit portion, the firstcircuit portion defining a phase locked loop (PLL) and configured tooperate at a subthreshold voltage, the second circuit portion includinga power management circuit.
 18. The apparatus of claim 17, wherein thefirst circuit portion is configured to output a signal having a selectedclock frequency.
 19. The apparatus of claim 17, wherein: the SoC havinga third circuit portion defining a frequency locked loop (FLL) and beingoperatively coupled to the first circuit portion and the second circuitportion, the first circuit portion and the third circuit portioncollectively configured to output a signal having a selected clockfrequency, the SoC having the ability to lock the frequency of the firstcircuit portion to the third circuit portion or (/and) to lock thefrequency of the third circuit portion to the first circuit portion, theSoC supporting operating modes in which one of the first circuit portionor the third circuit portion is placed in a low power off state whilethe other circuit portion maintains the output signal having a selectedclock frequency.
 20. The apparatus of claim 17, wherein: the firstcircuit portion is associated with an operational frequency range, theSoC having a third circuit portion defining a frequency locked loop(FLL) and associated with an operational frequency range, the thirdcircuit portion being operatively coupled to the first circuit portionand the second circuit portion, the first circuit portion and the thirdcircuit portion collectively configured to be operable over anoperational frequency range greater than the operational frequency rangeof the first circuit portion and the operational frequency range of thethird circuit portion.
 21. The apparatus of claim 1, wherein the firstwireless communications circuit includes an ultra-low-power architecturethat consumes less than 100 nW at a sensitivity of about −40 decibelsrelative to one milliwatt.
 22. An apparatus, comprising: a system on achip (SoC) including: a power supply circuit; a power management circuitoperatively coupled to the power supply circuit; a first wirelesscommunications circuit configured to receive an RF signal andoperatively coupled to the power supply circuit and the power managementcircuit, the first wireless communications circuit having a net radiofrequency (RF) power gain such that an output signal power is no greaterthan an input signal power before downconversion of the RF signal; and asecond wireless communications circuit operatively coupled to the powersupply circuit and the power management circuit.